CEI - EN 60191-6-12
Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
inactive
| Organization: | CEI |
| Publication Date: | 1 December 2002 |
| Status: | inactive |
| Page Count: | 28 |
scope:
Norma recepita mediante l'annuncio su CEINFORMA dicembre 2002.
Document History
June 1, 2012
Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
EN 60191-6-12
December 1, 2002
Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
Norma recepita mediante l'annuncio su CEINFORMA dicembre 2002.