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BSI - BS EN 60191-6-18

Mechanical standardization of semiconductor devices Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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Organization: BSI
Publication Date: 30 April 2010
Status: active
Page Count: 24
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN 60191-6-18
April 30, 2010
Mechanical standardization of semiconductor devices Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
A description is not available for this item.
BS EN 60191-6-18
April 30, 2010
Mechanical standardization of semiconductor devices Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
A description is not available for this item.

References

This document references:
EN 60191-6-5 - Mechanical Standardization of Semiconductor Devices Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)
Published by CENELEC on October 1, 2001
A description is not available for this item.
This document references:
EN 60191-6-4 - Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Published by CENELEC on July 1, 2003
A description is not available for this item.
This document references:
EN 60191-6-2 - Mechanical Standardization of Semiconductor Devices Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
Published by CENELEC on February 1, 2002
A description is not available for this item.
This document references:
BS EN 60191-6 - Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Published by BSI on April 30, 2010
A description is not available for this item.
This document references:
IEC 60191-6 - Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Published by IEC on November 1, 2009
This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted...
This document references:
IEC 60191-6-2 - Mechanical Standardization of Semiconductor Devices - Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
Published by IEC on December 1, 2001
A description is not available for this item.
This document references:
IEC 60191-6-5 - Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA)
Published by IEC on August 1, 2001
A description is not available for this item.
This document references:
IEC 60191-6-4 - Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
Published by IEC on June 1, 2003
A description is not available for this item.
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