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IEC 60191-6-2

Mechanical Standardization of Semiconductor Devices - Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages

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Organization: IEC
Publication Date: 1 December 2001
Status: active
Page Count: 20
ICS Code (Semiconductor devices in general): 31.080.01

Document History

IEC 60191-6-2
December 1, 2001
Mechanical Standardization of Semiconductor Devices - Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
A description is not available for this item.
December 1, 2001
Mechanical Standardization of Semiconductor Devices - Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
A description is not available for this item.
December 1, 2001
Mechanical Standardization of Semiconductor Devices - Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
A description is not available for this item.

References

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