UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IEC 60191-6-22

Mechanical standardization of semiconductor devices – Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

active, Most Current
Buy Now
Organization: IEC
Publication Date: 1 December 2012
Status: active
Page Count: 38
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Document History

IEC 60191-6-22
December 1, 2012
Mechanical standardization of semiconductor devices – Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

References

Advertisement