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IEC 60191-6-3

Mechanical Standardization of Semiconductor Devices - Part 6-3: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Measuring Methods for Package Dimensions of Quad Flat Packs (QFP)

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Organization: IEC
Publication Date: 1 September 2000
Status: active
Page Count: 24
ICS Code (Semiconductor devices in general): 31.080.01

Document History

IEC 60191-6-3
September 1, 2000
Mechanical Standardization of Semiconductor Devices - Part 6-3: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Measuring Methods for Package Dimensions of Quad Flat Packs (QFP)
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