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IEC 60191-6-12

Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guidelines for fine-pitch land grid array (FLGA)

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Organization: IEC
Publication Date: 1 June 2011
Status: active
Page Count: 42
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.

Document History

IEC 60191-6-12
June 1, 2011
Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guidelines for fine-pitch land grid array (FLGA)
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
June 1, 2002
Mechanical Standardization of Semiconductor Devices - Part 6-12: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Land Grid Array (FLGA) - Rectangular Type
A description is not available for this item.

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