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IEC 60191-6-4

Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)

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Organization: IEC
Publication Date: 1 June 2003
Status: active
Page Count: 22
ICS Code (Semiconductor devices in general): 31.080.01

Document History

IEC 60191-6-4
June 1, 2003
Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
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