IEC 60191-6-4
Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
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Organization: | IEC |
Publication Date: | 1 June 2003 |
Status: | active |
Page Count: | 22 |
ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History

IEC 60191-6-4
June 1, 2003
Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
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