UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Webinars & White Papers

CENELEC - EN 60191-6-4

Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

active, Most Current
Organization: CENELEC
Publication Date: 1 July 2003
Status: active
Page Count: 20
ICS Code (Semiconductor devices in general): 31.080.01

Document History

EN 60191-6-4
July 1, 2003
Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
A description is not available for this item.
Advertisement