IEC 60191-6-5
Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA)
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| Organization: | IEC |
| Publication Date: | 1 August 2001 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
IEC 60191-6-5
August 1, 2001
Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA)
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