IEC 60191-6
Mechanical Standardization of Semiconductor Devices - Part 6: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages
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| Organization: | IEC |
| Publication Date: | 1 December 1990 |
| Status: | inactive |
| Page Count: | 63 |
Document History
November 1, 2009
Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted...
September 1, 2004
Mechanical Standardization of Semiconductor Devices - Part 6: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages
A description is not available for this item.
IEC 60191-6
December 1, 1990
Mechanical Standardization of Semiconductor Devices - Part 6: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages
A description is not available for this item.