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IEC 60749-3

Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination

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Organization: IEC
Publication Date: 1 March 2017
Status: active
Page Count: 16
ICS Code (Semiconductor devices in general): 31.080.01
scope:

The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.

Document History

IEC 60749-3
March 1, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement...
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1
A description is not available for this item.
April 1, 2002
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 3: External Visual Examination
A description is not available for this item.

References

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