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BSI - BS EN IEC 60749-20

Semiconductor devices — Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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Organization: BSI
Publication Date: 31 October 2020
Status: active
Page Count: 32
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN IEC 60749-20
October 31, 2020
Semiconductor devices — Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.
January 31, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.
July 7, 2003
Semiconductor devices Mechanical and climatic test methods Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.

References

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