UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

BSI - BS EN 60749-20

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

inactive
Buy Now
Organization: BSI
Publication Date: 31 January 2010
Status: inactive
Page Count: 32
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN IEC 60749-20
October 31, 2020
Semiconductor devices — Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.
BS EN 60749-20
January 31, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.
BS EN 60749-20
July 7, 2003
Semiconductor devices Mechanical and climatic test methods Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.

References

This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 60749-35 - Semiconductor devices – Mechanical and climatic test methods – Part 35: Acoustic microscopy for plastic encapsulated electronic components
Published by IEC on July 1, 2006
This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for...
This document references:
IEC 60749-3 - Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
Published by IEC on March 1, 2017
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement...
This document references:
EN IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by CENELEC on May 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068‑2‑58. This...
This document references:
EN 60749-3 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Published by CENELEC on June 1, 2017
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement...
This document is referenced by:
BS EN 60749-20-1 - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Published by BSI on July 31, 2009
A description is not available for this item.
This document is referenced by:
BS EN 60749-35 - Semiconductor devices Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components
Published by BSI on November 30, 2006
A description is not available for this item.
This document is referenced by:
BS EN 60191-6-19 - Mechanical standardization of semiconductor devices Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Published by BSI on June 30, 2010
A description is not available for this item.
This document is referenced by:
BS EN IEC 60749-30 - Semiconductor devices — Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Published by BSI on September 30, 2020
A description is not available for this item.
View Less
View All

Related Products

Searching for related products...

Advertisement