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BSI - BS EN 60191-6-19

Mechanical standardization of semiconductor devices Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

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Organization: BSI
Publication Date: 30 June 2010
Status: active
Page Count: 18
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN 60191-6-19
June 30, 2010
Mechanical standardization of semiconductor devices Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
A description is not available for this item.

References

This document references:
IEC 60749-20 - Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by IEC on August 1, 2020
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This document references:
IEC 60191-6-5 - Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA)
Published by IEC on August 1, 2001
A description is not available for this item.
This document references:
IEC 60191-6-2 - Mechanical Standardization of Semiconductor Devices - Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
Published by IEC on December 1, 2001
A description is not available for this item.
This document references:
BS EN IEC 60749-20 - Semiconductor devices — Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by BSI on October 31, 2020
A description is not available for this item.
This document references:
EN 60191-6-2 - Mechanical Standardization of Semiconductor Devices Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
Published by CENELEC on February 1, 2002
A description is not available for this item.
This document references:
EN 60191-6-5 - Mechanical Standardization of Semiconductor Devices Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)
Published by CENELEC on October 1, 2001
A description is not available for this item.
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