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IEC 60749-20

Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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Organization: IEC
Publication Date: 1 August 2020
Status: active
Page Count: 60
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

Document History

IEC 60749-20
August 1, 2020
Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
December 1, 2008
Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat CORRIGENDUM 1
A description is not available for this item.
September 1, 2002
Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.

References

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