UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close

IEC 60749-20

Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

active, Most Current
Buy Now
Organization: IEC
Publication Date: 1 December 2008
Status: active
Page Count: 58
ICS Code (Semiconductor devices in general): 31.080.01

Document History

IEC 60749-20
December 1, 2008
Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat CORRIGENDUM 1
A description is not available for this item.
September 1, 2002
Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.

References

Advertisement