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BSI - BS EN 60749-20-1

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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Organization: BSI
Publication Date: 31 July 2009
Status: active
Page Count: 38
ICS Code (Semiconductor devices in general): 31.080.01

Document History

18/30375624 DC
July 13, 2018
Draft BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
A description is not available for this item.
BS EN 60749-20-1
July 31, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
A description is not available for this item.

References

This document references:
IEC 60749-37 - Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
Published by IEC on January 1, 2008
A description is not available for this item.
This document references:
IEC 60749-20 - Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by IEC on August 1, 2020
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This document references:
60749-39 - Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Published by IEC on November 1, 2021
This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of...
This document references:
IEC 60749-30 - Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Published by IEC on August 1, 2020
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the...
This document references:
BS EN IEC 60749-20 - Semiconductor devices — Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by BSI on October 31, 2020
A description is not available for this item.
This document references:
EN IEC 60749-30 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Published by CENELEC on September 1, 2020
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the...
This document references:
EN IEC 60749-37 - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Published by CENELEC on November 1, 2022
This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an...
This document references:
J-STD-033 - Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Published by IPC on August 1, 2014
A description is not available for this item.
This document references:
EN IEC 60749-39 - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Published by CENELEC on January 1, 2022
This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of...
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