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BSI - BS EN 60749-20-1

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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Organization: BSI
Publication Date: 31 July 2009
Status: active
Page Count: 38
ICS Code (Semiconductor devices in general): 31.080.01

Document History

July 13, 2018
Draft BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
A description is not available for this item.
BS EN 60749-20-1
July 31, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
A description is not available for this item.

References

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