BSI - 18/30375624 DC
Draft BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
pending
| Organization: | BSI |
| Publication Date: | 13 July 2018 |
| Status: | pending |
| Page Count: | 39 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
18/30375624 DC
July 13, 2018
Draft BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
A description is not available for this item.
July 31, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
A description is not available for this item.