CENELEC - EN IEC 60749-39
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 January 2022 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.
These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
Document History
EN IEC 60749-39
January 1, 2022
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of...
August 1, 2006
Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
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