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IEC 60749-35

Semiconductor devices – Mechanical and climatic test methods – Part 35: Acoustic microscopy for plastic encapsulated electronic components

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Organization: IEC
Publication Date: 1 July 2006
Status: active
Page Count: 52
ICS Code (Semiconductor devices): 31.080
scope:

This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

 

Document History

IEC 60749-35
July 1, 2006
Semiconductor devices – Mechanical and climatic test methods – Part 35: Acoustic microscopy for plastic encapsulated electronic components
This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for...

References

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