Semiconductor devices – Mechanical and climatic test methods – Part 35: Acoustic microscopy for plastic encapsulated electronic components
|Publication Date:||1 July 2006|
|ICS Code (Semiconductor devices):||31.080|
This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.