IEC 60749-3
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
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| Organization: | IEC |
| Publication Date: | 1 March 2017 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
Document History
IEC 60749-3
March 1, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement...
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1
A description is not available for this item.
April 1, 2002
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 3: External Visual Examination
A description is not available for this item.