Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
|Publication Date:||1 March 2017|
|ICS Code (Semiconductor devices in general):||31.080.01|
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.