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IPC - J-STD-003 CHINESE

Solderability Tests for Printed Boards

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Organization: IPC
Publication Date: 1 January 2014
Status: active
Page Count: 44

Document History

J-STD-003 CHINESE
January 1, 2014
Solderability Tests for Printed Boards
A description is not available for this item.
J-STD-003 CHINESE
March 1, 2007
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This...

References

This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
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