IEC 62137-1-1
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-1: Pull strength test
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| Organization: | IEC |
| Publication Date: | 1 July 2007 |
| Status: | active |
| Page Count: | 34 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
IEC 62137-1-1
July 1, 2007
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-1: Pull strength test
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