Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
|Publication Date:||1 December 2017|
|ICS Code (Semiconductor devices in general):||31.080.01|
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applicable to cavity-type packages.
NOTE This test method describes a swept sine test. A random vibration test is described in JEDEC document JESD 22-B103.