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IEC 60749-12

Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency

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Organization: IEC
Publication Date: 1 December 2017
Status: active
Page Count: 18
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applicable to cavity-type packages.

NOTE This test method describes a swept sine test. A random vibration test is described in JEDEC document JESD 22-B103.

Document History

IEC 60749-12
December 1, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It...
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 12: Vibration, variable frequency CORRIGENDUM 1
A description is not available for this item.
April 1, 2002
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 12: Vibration, Variable Frequency
A description is not available for this item.

References

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