IPC - TM-650 2.6.1G
Fungus Resistance of Printed Board Materials
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 March 2007 |
| Status: | active |
| Page Count: | 3 |
scope:
The fungus resistance test is used to determine the resistance of materials to fungi and to determine if such material is adversely affected by fungi under conditions favorable for their development, namely high humidity, warm atmosphere, and presence of inorganic salts.
Document History
TM-650 2.6.1G
March 1, 2007
Fungus Resistance of Printed Board Materials
The fungus resistance test is used to determine the resistance of materials to fungi and to determine if such material is adversely affected by fungi under conditions favorable for their development,...
May 1, 2004
Fungus Resistance Printed Wiring Materials
A description is not available for this item.
August 1, 1997
Fungus Resistance Printed Wiring Materials
The fungus resistance test is used to determine the resistance of materials to fungi and to determine if such material is adversely affected by fungi under conditions favorable for their development,...
January 1, 1995
Fungus Resistance Printed Wiring Materials
A description is not available for this item.