IPC-2292
Design Standard for Printed Electronics on Flexible Substrates
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| Organization: | IPC |
| Publication Date: | 1 March 2018 |
| Status: | active |
| Page Count: | 72 |
scope:
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertain to this standard, are materials or devices which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable (e.g., fabrics, textiles, stretchable polymers, etc.).
Document History
October 1, 2022
Design Standard for Printed Electronics on Flexible Substrates
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible...
IPC-2292
March 1, 2018
Design Standard for Printed Electronics on Flexible Substrates
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible...