BSI - BS PD IEC TS 62647-4
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder Part 4: Ball grid array (BGA) re-balling
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| Organization: | BSI |
| Publication Date: | 30 April 2018 |
| Status: | active |
| Page Count: | 44 |
| ICS Code (Production. Production management): | 03.100.50 |
| ICS Code (Electronic components in general): | 31.020 |
| ICS Code (Aerospace electric equipment and systems): | 49.060 |
Document History
BS PD IEC TS 62647-4
April 30, 2018
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder Part 4: Ball grid array (BGA) re-balling
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