NEN-EN-IEC 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 June 2014 |
| Status: | active |
| Page Count: | 58 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
NEN-EN-IEC 61190-1-2 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.
Document History
NEN-EN-IEC 61190-1-2
June 1, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
NEN-EN-IEC 61190-1-2 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard...
August 1, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This...
September 1, 2002
Attachment materials for electronic assemblies - Part 1-2: Requirements for soldering pastes for high quality interconnections in electronics assembly
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly.