IPC-TM-650 2.4.53
Dye and Pull Test Method (Formerly Known as Dye and Pry)
active, Most Current
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| Organization: | IPC |
| Publication Date: | 1 August 2017 |
| Status: | active |
| Page Count: | 11 |
scope:
This test method details the dye and pull procedure (formerly known as dye and pry) utilizing dye penetrant analysis of surface-mount technology (SMT) components to confirm assembly process parameters and solder joint quality/ integrity.
This Test Method is for observation only, to determine the existence of dye indications.
Document History
IPC-TM-650 2.4.53
August 1, 2017
Dye and Pull Test Method (Formerly Known as Dye and Pry)
This test method details the dye and pull procedure (formerly known as dye and pry) utilizing dye penetrant analysis of surface-mount technology (SMT) components to confirm assembly process...