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IPC-TM-650 2.4.53

Dye and Pull Test Method (Formerly Known as Dye and Pry)

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Organization: IPC
Publication Date: 1 August 2017
Status: active
Page Count: 11
scope:

This test method details the dye and pull procedure (formerly known as dye and pry) utilizing dye penetrant analysis of surface-mount technology (SMT) components to confirm assembly process parameters and solder joint quality/ integrity.

This Test Method is for observation only, to determine the existence of dye indications.

Document History

IPC-TM-650 2.4.53
August 1, 2017
Dye and Pull Test Method (Formerly Known as Dye and Pry)
This test method details the dye and pull procedure (formerly known as dye and pry) utilizing dye penetrant analysis of surface-mount technology (SMT) components to confirm assembly process...

References

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