IPC - TM-650 2.4.28B
Adhesion, Solder Mask (Non-Melting Metals)
inactive, Most Current
| Organization: | IPC |
| Publication Date: | 1 August 1997 |
| Status: | inactive |
| Page Count: | 1 |
scope:
This test method defines the procedure for determining the adhesion of solder masks used over nonmelting metals such as copper, gold, nickel, and tin printed wiring boards, both prior to and after soldering.
Document History
TM-650 2.4.28B
August 1, 1997
Adhesion, Solder Mask (Non-Melting Metals)
This test method defines the procedure for determining the adhesion of solder masks used over nonmelting metals such as copper, gold, nickel, and tin printed wiring boards, both prior to and after...
August 1, 1982
Adhesion, Solder Mask (Non-Melting Metals)
A description is not available for this item.