IPC - TM-650 2.4.51
Self Shimming Thermally Conductive Adhesives
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 1 |
scope:
To determine dispersion of glass microbeads in Self Shimming Thermally Conductive Adhesives, thus ensuring the proper self-induced gap. It is important for the beads to be well dispersed throughout the batch, since this adhesive is designed for bonding of electrical components to printed circuit boards where electrical isolation, provided by a consistent gap, is required. The testing is performed by measuring the gap induced by the adhesive placed between two flat metal surfaces.
Document History
TM-650 2.4.51
January 1, 1995
Self Shimming Thermally Conductive Adhesives
To determine dispersion of glass microbeads in Self Shimming Thermally Conductive Adhesives, thus ensuring the proper self-induced gap. It is important for the beads to be well dispersed throughout...