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IPC-9201

Surface Insulation Resistance Handbook

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Organization: IPC
Publication Date: 1 August 2007
Status: active
Page Count: 100
scope:

This document is intended to cover the broad spectrum of temperature-humidity (TH) testing, associated terminology, and suggested techniques for proper testing. This edition of the Handbook primarily covers the test methods used in the United States. Future revisions of the Handbook will address more of the available international test methods.

 

Document History

IPC-9201
August 1, 2007
Surface Insulation Resistance Handbook
This document is intended to cover the broad spectrum of temperature-humidity (TH) testing, associated terminology, and suggested techniques for proper testing. This edition of the Handbook primarily...
IPC-9201
July 1, 1996
Surface Insulation Resistance Handbook
This document is intended to cover the broad spectrum of temperature-humidity (TH) testing, associated terminology, and suggested techniques for proper testing. This edition of the Handbook primarily...

References

This document references:
IPC-TM-650 2.6.3.7 - Surface Insulation Resistance
Published by IPC on March 1, 2007
This test method is used to quantify the deleterious effects of fabrication, process or handling residues on Surface Insulation Resistance (SIR) in the presence of moisture. The electrodes are long...
This document references:
TM-650 2.6.3.3B - Surface Insulation Resistance, Fluxes
Published by IPC on June 1, 2004
This test method is to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. This test...
This document references:
J-STD-001 - Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
Published by IPC on February 1, 2020
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G and IPC-A-610G to ensure the reliability of mission-critical soldered...
This document references:
ASTM D263 - Standard Specification for Chrome Oxide Green Pigment
Published by ASTM on May 15, 2005
This specification covers the dry pigment commercially known as chrome oxide green. The values stated in SI units are to be regarded as the standard. The values given in parentheses are for...
This document references:
J-STD-001 - Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
Published by IPC on February 1, 2020
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G and IPC-A-610G to ensure the reliability of mission-critical soldered...
This document references:
IPC-TM-650 2.6.3.2 - Surface Insulation and Moisture Resistance, Copper Clad Flexible Dielectric Material
Published by IPC on August 14, 2015
This test method defines the procedures for determining the surface insulation resistance of a copper foil clad flexible dielectric material in the presence of moisture. This test method may be used...
This document references:
TM-650 2.6.3.3B - Surface Insulation Resistance, Fluxes
Published by IPC on June 1, 2004
This test method is to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. This test...
This document references:
IPC-TM-650 2.6.3.7 - Surface Insulation Resistance
Published by IPC on March 1, 2007
This test method is used to quantify the deleterious effects of fabrication, process or handling residues on Surface Insulation Resistance (SIR) in the presence of moisture. The electrodes are long...
This document is referenced by:
IPC-9203 - Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
Published by IPC on May 1, 2012
INTRODUCTION Of the various methods for the determination of ionic residues, the method of choice is ion chromatography, which determines both the type of ionic residue and the amount present. The...
This document is referenced by:
IPC-TP-1114 - Laymans´s Guide to Qualifying a Process to J-STD-001B
Published by IPC on January 1, 1998
Introduction Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or...
This document is referenced by:
IEC/TS 62647-22 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 22: Technical guidelines
Published by IEC on September 1, 2013
This part of IEC 62647 is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment...
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