Surface Insulation and Moisture Resistance, Copper Clad Flexible Dielectric Material
|Publication Date:||14 August 2015|
This test method defines the procedures for determining the surface insulation resistance of a copper foil clad flexible dielectric material in the presence of moisture. This test method may be used for testing both metal clad dielectric as produced per IPC-4204 and bondply dielectric that must be evaluated for surface insulation resistance in a laminated format as metal clad dielectric.
The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of materials to the deleterious effects of high humidity and heat conditions. The test method is designed to simultaneously assess leakage current caused by ionized water films and electrochemical degradation (corrosion and dendritic growth) of the test vehicle.