IPC - TM-650 2.6.3.2B
Insulation and Moisture Resistance, Flexible Base Dielectric
inactive
| Organization: | IPC |
| Publication Date: | 1 May 1988 |
| Status: | inactive |
| Page Count: | 4 |
scope:
This test method defines the procedures for determining the moisture and insulation resistance of a copper foil clad flexible dielectric material. The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of materials to the deteriorative effects of high humidity and heat conditions, typical of tropical environments.
Document History
August 14, 2015
Surface Insulation and Moisture Resistance, Copper Clad Flexible Dielectric Material
This test method defines the procedures for determining the surface insulation resistance of a copper foil clad flexible dielectric material in the presence of moisture. This test method may be used...
TM-650 2.6.3.2B
May 1, 1988
Insulation and Moisture Resistance, Flexible Base Dielectric
This test method defines the procedures for determining the moisture and insulation resistance of a copper foil clad flexible dielectric material. The moisture resistance test is performed for the...