UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.3.2G

Chemical Resistance of Flexible Printed Board Materials

active, Most Current
Organization: IPC
Publication Date: 1 December 2007
Status: active
Page Count: 3
scope:

To determine the effect of chemicals used in printed board fabrication on metal-clad and bare flexible dielectric materials. Caution: This test method uses hazardous chemicals to generate data. The person implementing this test method should refer to the appropriate Material Safety Data Sheet or equivalent for each chemical for safe operation.

Document History

TM-650 2.3.2G
December 1, 2007
Chemical Resistance of Flexible Printed Board Materials
To determine the effect of chemicals used in printed board fabrication on metal-clad and bare flexible dielectric materials. Caution: This test method uses hazardous chemicals to generate data. The...
May 1, 1998
Chemical Resistance of Flexible Printed Wiring Materials
A description is not available for this item.
January 1, 1993
Chemical Resistance of Flexible Printed Wiring Materials
A description is not available for this item.

References

Advertisement