scope:

The International Standard, of which this Technical Report forms a part, has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.