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IEC 62137-1-4

Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-4: Cyclic bending test

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Organization: IEC
Publication Date: 1 January 2009
Status: active
Page Count: 30
ICS Code (Electronic component assemblies): 31.190

Document History

IEC 62137-1-4
January 1, 2009
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-4: Cyclic bending test
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