IEC 62137-1-4
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-4: Cyclic bending test
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Organization: | IEC |
Publication Date: | 1 January 2009 |
Status: | active |
Page Count: | 30 |
ICS Code (Electronic component assemblies): | 31.190 |
Document History
IEC 62137-1-4
January 1, 2009
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-4: Cyclic bending test
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