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IEC 60749-32

Semiconductor devices – Mechanical and climatic test methods – Part 32: Flammability of plastic-encapsulated devices (externally induced)

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Organization: IEC
Publication Date: 1 November 2010
Status: active
Page Count: 14
ICS Code (Semiconductor devices in general): 31.080.01
scope:

Scope and object

This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits).

The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device.

NOTE This test is identical to the test method contained in 1.2 of chapter 4 of IEC 60749 (1996), apart from the addition of this clause, the addition of titles to clauses 2 and 3 and renumbering.

Document History

IEC 60749-32
November 1, 2010
Semiconductor devices – Mechanical and climatic test methods – Part 32: Flammability of plastic-encapsulated devices (externally induced)
Scope and object This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to...
July 1, 2010
AMENDMENT 1 Semiconductor devices – Mechanical and climatic test methods – Part 32: Flammability of plastic-encapsulated devices (externally induced)
A description is not available for this item.
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 32: Flammability of plastic-encapsulated devices (externally induced) CORRIGENDUM 1
A description is not available for this item.
August 1, 2002
Semiconductor devices – Mechanical and climatic test methods – Part 32: Flammability of plastic-encapsulated devices (externally induced)
A description is not available for this item.

References

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