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IPC - JEDEC J-STD-033 DE

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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Organization: IPC
Publication Date: 1 October 2005
Status: active
Page Count: 30

Document History

J-STD-033 GERMAN
February 1, 2012
Solderability Tests for Printed Boards
A description is not available for this item.
JEDEC J-STD-033 DE
October 1, 2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
A description is not available for this item.

References

This document references:
ASTM F1249 - Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor
Published by ASTM on June 1, 2020
This test method covers a procedure for determining the rate of water vapor transmission through flexible barrier materials. The method is applicable to sheets and films up to 3 mm (0.1 in.) in...
This document references:
F392/F392M - Standard Practice for Conditioning Flexible Barrier Materials for Flex Durability
October 1, 2023
This practice covers conditioning of flexible barrier materials for the determination of flex resistance. Subsequent testing can be performed to determine the effects of flexing on material...
This document references:
EIA-541 - Packaging Material Standards for ESD Sensitive Items
Published by ECIA on June 1, 1988
This standard applies to several different categories of electrostatic protective packaging materials. These packaging materials may possess certain electrostatic properties such as to prevent...
This document references:
IPC-7711/7721 - Rework, Modification and Repair of Electronic Assemblies Amendment 1
Published by IPC on July 1, 2020
A description is not available for this item.
This document references:
IPC/JEDEC J-STD-020F - Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published by IPC on December 1, 2022
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
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