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IPC - J-STD-033 GERMAN

Solderability Tests for Printed Boards

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Organization: IPC
Publication Date: 1 February 2012
Status: active
Page Count: 32

Document History

J-STD-033 GERMAN
February 1, 2012
Solderability Tests for Printed Boards
A description is not available for this item.
JEDEC J-STD-033 DE
October 1, 2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
A description is not available for this item.

References

This document is referenced by:
DIN IEC/TS 62647-1 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC/TS 62647-1:2012)
Published by DIN on July 1, 2013
Dieser Teil der Reihe IEC/TS 62647 legt die Ziele und Anforderungen für die Dokumentation von Prozessen fest, die Kunden und regelsetzenden Stellen versichern, dass elektronische ADHP-Systeme, die...
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