scope:

This technical report (TR) explains issues associated with today's field induced charged device model (FICDM) test methods and describes the advantages and disadvantages of the new 50-ohm contact charged device model (CCDM) test method. In addition, it will also discuss the differences between real world charged device model (CDM) events, tester CDM simulations, and the equivalent circuits behind each of these events. Finally, it will discuss correlation work that has been performed to determine whether this new method provides the same results as the present FICDM test method and what additional work remains.

The present FICDM test method attempts to replicate CDM events which may occur during the device manufacturing, handling and testing process, to verify that on-chip ESD protection can adequately protect against this type of threat. However, in trying to reproduce a "real world" event using an air discharge, (mode of FICDM discharge), repeatability and reproducibility errors have been measured in the FICDM qualification testers that can exceed the specified measurement tolerance of 20%^[4]. The scope and purpose of ANSI/ESDA/JEDEC JS-002 ^[2] are included below for reference purposes.