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DLA - DSCC-DWG-V62/13610 REV A

MICROCIRCUIT, LINEAR, WIDEBAND, LOW DISTORTION, DIFFERENTIAL AMPLIFIER, MONOLITHIC SILICON

active, Most Current
Organization: DLA
Publication Date: 7 November 2018
Status: active
Page Count: 17
scope:

This drawing documents the general requirements of a high performance wideband, low distortion, differential amplifier microcircuit, with an operating temperature range of -55OC to +125OC.

Document History

DSCC-DWG-V62/13610 REV A
November 7, 2018
MICROCIRCUIT, LINEAR, WIDEBAND, LOW DISTORTION, DIFFERENTIAL AMPLIFIER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance wideband, low distortion, differential amplifier microcircuit, with an operating temperature range of -55OC to +125OC.
DSCC-DWG-V62/13610
July 1, 2013
MICROCIRCUIT, LINEAR, WIDEBAND, LOW DISTORTION, DIFFERENTIAL AMPLIFIER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance wideband, low distortion, differential amplifier microcircuit, with an operating temperature range of -55°C to +125°C.

References

This document references:
JEP95 JEDEC STD NO. 95-1 - JEDEC Standard No. 95-1 Section 4 Design Guidelines
Published by JEDEC on March 1, 1997
INTRODUCTION History JEDEC REGISTERED AND STANDARD OUTLINES FOR SEMICONDUCTOR DEVICES, JEDEC PUBLICATION 95, is the official JEDEC Publication that contains the registered or standard mechanical...
This document references:
JEDEC JESD 51-2 - Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
Published by JEDEC on January 1, 2008
This document outlines the environmental conditions necessary to ensure accuracy and repeatability for a standard junction-to-ambient thermal resistance measurement in natural convection.
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
This document references:
JEDEC JESD 51-8 - Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
Published by JEDEC on October 1, 1999
This specification should be used in conjunction with the overview document JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) [1] and the electrical...
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