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BSI - BS EN IEC 60286-3

Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes

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Organization: BSI
Publication Date: 31 March 2019
Status: active
Page Count: 48
ICS Code (Electronic components in general): 31.020
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN IEC 60286-3
March 31, 2019
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
A description is not available for this item.
BS EN 60286-3
August 31, 2013
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
A description is not available for this item.
BS EN 60286-3
October 31, 2007
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
A description is not available for this item.
BS EN 60286-3
October 31, 2007
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
A description is not available for this item.
BS EN 60286-3
April 15, 1998
Packaging of Components for Automatic Handling Part 3: Packaging of Leadless Components on Continuous Tapes
A description is not available for this item.

References

This document references:
IEC 60191-2 - Amendment 11 Mechanical standardization of semiconductor devices – Part 2: Dimensions
Published by IEC on November 1, 2004
A description is not available for this item.
This document references:
EN ISO 11469 - Plastics - Generic identification and marking of plastics products
Published by CEN on October 1, 2016
This International Standard specifies a system of uniform marking of products that have been fabricated from plastics materials. Provision for the process or processes to be used for marking is...
This document references:
IEC/TR 62258-3 - Semiconductor die products – Part 3: Recommendations for good practice in handling, packing and storage
Published by IEC on August 1, 2010
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached...
This document references:
ISO/IEC 16388 - Information technology - Automatic identification and data capture techniques - Code 39 bar code symbology specification
Published by ISO on May 15, 2007
This International Standard specifies the requirements for the bar code symbology known as Code 39; it specifies Code 39 symbology characteristics, data character encodation, dimensions, tolerances,...
This document references:
ISO/IEC 16388 - Information technology - Automatic identification and data capture techniques - Code 39 bar code symbology specification
Published by ISO on May 15, 2007
This International Standard specifies the requirements for the bar code symbology known as Code 39; it specifies Code 39 symbology characteristics, data character encodation, dimensions, tolerances,...
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