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NPFC - MIL-STD-883-2

TEST METHOD STANDARD MECHANICAL TEST METHODS FOR MICROCIRCUITS PART 2: TEST METHODS 2000-2999

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Organization: NPFC
Publication Date: 16 September 2019
Status: active
Page Count: 385

Document History

MIL-STD-883-2 CHANGE 1
January 12, 2022
TEST METHOD STANDARD MECHANICAL TEST METHODS FOR MICROCIRCUITS PART 2: TEST METHODS 2000-2999
Purpose. Part 2 of this test method standard establishes uniform test methods for the mechanical testing to determine resistance to deleterious effects of natural elements and conditions surrounding...
MIL-STD-883-2
September 16, 2019
TEST METHOD STANDARD MECHANICAL TEST METHODS FOR MICROCIRCUITS PART 2: TEST METHODS 2000-2999
A description is not available for this item.

References

This document is referenced by:
QML-38535-QPD - Integrated Circuits (Microcircuits) Manufacturing, General Specification for
Published by DLA on January 30, 2024
QUALIFIED MANUFACTURERS LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-PRF-38535 INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING GENERAL REQUIREMENTS FOR This list has been prepared...
This document is referenced by:
MIL-STD-750-2B CHANGE 1 - TEST METHOD STANDARD MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES PART 2: TEST METHODS 2001 THROUGH 2999
Published by DLA on June 23, 2023
Purpose. Part 2 of this test method standard establishes uniform test methods for the mechanical testing of semiconductor devices to determine resistance to deleterious effects of natural elements...
This document is referenced by:
MIL-PRF-55310 - OSCILLATOR, CRYSTAL CONTROLLED, GENERAL SPECIFICATION FOR
Published by NPFC on March 12, 2020
Scope. This specification covers the general requirements for quartz crystal oscillators used in electronic equipment.
This document is referenced by:
MIL-PRF-55310/29 - OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 0.2 MHz THROUGH 85 MHz, HERMETIC SEAL, SQUARE WAVE, HCMOS
Published by NPFC on April 14, 2020
A description is not available for this item.
This document is referenced by:
MIL-PRF-31032/6C (1) - PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC OR THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
Published by DLA on September 16, 2022
Scope. This specification covers the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or...
This document is referenced by:
MIL-PRF-31032/5 - PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
Published by NPFC on May 5, 2020
Scope. This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated...
This document is referenced by:
ASTM E1161 - Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
Published by ASTM on June 1, 2009
This practice provides the minimum requirements for nondestructive radiologic examination of semiconductor devices, microelectronic devices, electromagnetic devices, electronic and electrical...
This document supersedes:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
This document supersedes:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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