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IPC-9121

Troubleshooting for Printed Board Fabrication Processes Amendment 2

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Organization: IPC
Publication Date: 1 September 2019
Status: active
Page Count: 36

Document History

9121A
February 1, 2022
Troubleshooting for Printed Board Fabrication Processes
This handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Purpose The purpose of this standard is to help designers, manufacturers...
IPC-9121
September 1, 2019
Troubleshooting for Printed Board Fabrication Processes Amendment 2
A description is not available for this item.
IPC-9121
April 1, 2018
Troubleshooting for PCB Fabrication Processes Amendment 1
A description is not available for this item.
IPC-9121
February 1, 2016
Troubleshooting for Printed Board Fabrication Processes
GENERAL INTRODUCTION This handbook provides problems, causes and possible corrective actions related to PWB manufacturing processes. To keep this document current, readers are encouraged to submit...

References

This document references:
IPC-4552 - Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Published by IPC on August 1, 2017
Statement of Scope This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a...
This document references:
TM-650 2.6.26A - DC Current Induced Thermal Cycling Test
Published by IPC on May 1, 2014
These methods determine the physical endurance of representative coupons of printed boards to a series of high temperature excursions from ambient. The temperature excursions cause thermo-mechanical...
This document references:
IPC-TM-650 2.6.27 - Thermal Stress, Convection Reflow Assembly Simulation
Published by IPC on February 1, 2020
This method is intended to simulate exposure to the thermal conditions by convection reflow assembly. Purpose This method shall be used to replicate the thermodynamic effects by assembly on the test...
This document references:
IPC-TM-650 2.6.7.2 - Thermal Shock, Thermal Cycle and Continuity
Published by IPC on March 1, 2020
This method subjects unpopulated test specimens (samples) to sudden, extreme changes in temperature in order to evaluate the quality of interconnects formed during the manufacturing processes....
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