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IPC - TM-650 2.6.26A

DC Current Induced Thermal Cycling Test

active, Most Current
Organization: IPC
Publication Date: 1 May 2014
Status: active
Page Count: 10
scope:

These methods determine the physical endurance of representative coupons of printed boards to a series of high temperature excursions from ambient. The temperature excursions cause thermo-mechanical fatigue of the electrical interconnect structures.

The test coupon is resistance heated by passing DC current through the coupon to bring the temperature of the copper to a designated temperature. Switching the current on and off creates thermal cycles between room temperature and the designated temperature within the sample. The laminate and surrounding materials are heated to different extents depending on the thermal conductivity of the materials. The thermal cycling can accelerate latent interconnect anomalies to failure.

The number of cycles achieved permits a quantitative assessment of the performance.

Document History

TM-650 2.6.26A
May 1, 2014
DC Current Induced Thermal Cycling Test
These methods determine the physical endurance of representative coupons of printed boards to a series of high temperature excursions from ambient. The temperature excursions cause thermo-mechanical...
May 1, 2001
DC Current Induced Thermal Cycling Test
This test measures changes in resistance of plated-through hole barrels and internal layer connections as holes are subjected to thermal cycling. Thermal cycling is produced by the application of a...

References

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