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IPC-TR-486

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations

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Organization: IPC
Publication Date: 1 July 2001
Status: active
Page Count: 56
scope:

The scope of this test program includes a study of the repeatability and reproducibility of IST and thermal stress test method to determine the presence of inner-layer separations, development of guidelines for the use of IST testing and test data as a substitute for thermal stress testing in acceptance of product for shipment and to generate a report assessing all pertinent criteria of the program purpose.

Document History

IPC-TR-486
July 1, 2001
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations
The scope of this test program includes a study of the repeatability and reproducibility of IST and thermal stress test method to determine the presence of inner-layer separations, development of...

References

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