IEC TR 61191-7
Printed board assemblies – Part 7: Technical cleanliness of components and printed board assemblies
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| Organization: | IEC |
| Publication Date: | 1 March 2020 |
| Status: | active |
| Page Count: | 120 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61191 serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
Document History
IEC TR 61191-7
March 1, 2020
Printed board assemblies – Part 7: Technical cleanliness of components and printed board assemblies
This part of IEC 61191 serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns...