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IPC-4101

Specification for Base Materials for Rigid and Multilayer Printed Boards

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Organization: IPC
Publication Date: 1 March 2017
Status: active
Page Count: 176
scope:

This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.

Document History

IPC-4101
March 1, 2017
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
March 1, 2017
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
April 1, 2014
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
April 1, 2014
Specification for Base Materials for Rigid and Multilayer Printed Boards
A description is not available for this item.
August 1, 2009
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
June 1, 2006
Specification for Base Materials for Rigid and Multilayer Printed Boards
A description is not available for this item.
June 1, 2006
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
June 1, 2006
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
December 1, 2001
Specification for Base Materials for Rigid and Multilayer Printed Boards
A description is not available for this item.
December 1, 2001
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
December 1, 1997
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...

References

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