Sectional Design Standard for Rigid Organic Printed Boards
|Publication Date:||1 October 2020|
This standard establishes the specific requirements for the design of rigid organic printed boards.
The following overview describes what are the core knowledge and competencies to best serve in the role of Printed Board Design Layout as a stand-alone professional, or as the engineer performing this responsibility. Today's printed board designer needs to address numerous perspectives for success within a given schedule, with the goal of making the first design iteration work as intended, summarized as:
• Layout Solvability - Complex Packaging Skillset
• Electrical Integrity - Signal & Power Performance on all Layers
• Manufacturability - Design for Excellence (DfX) Considerations for High Yield and Lower Cost
• Application considerations - Environmental, Performance, Shelf life, etc.
The result provides for optimal component placement, routing density and electrical performance to achieve an efficient design with high yield and defect-free manufacturability.
The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 to produce printed boards that perform as an integral part of functional electronic hardware.
The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered. They may be any combination able to perform the physical, thermal, environmental, and electronic function.
Document hierarchy shall be in accordance with the generic standard IPC-2221.
Presentation shall be in accordance with the generic standard IPC-2221.
Interpretation shall be in accordance with the generic standard IPC-2221.
Definition of Terms
The definition of all terms used herein shall be in accordance with IPC-T-50 and as defined in 1.5.1.
As Agreed Between User and Supplier (AABUS)
A bilateral agreement which indicates additional or alternate requirements to be decided between the user and the supplier in the procurement documentation. Examples include contractual requirements, modifications to purchase documentation and information on the drawing. Agreements can be used to define test methods, conditions, frequencies, categories or acceptance criteria within a test, if not already established.
Classification of Products
Classification of products shall be in accordance with the generic standard IPC-2221 and as defined in 1.6.1.
Printed Board Type
This standard provides design information for different printed board types. Printed board types are classified as:
Type 1 - Single-Sided Printed Board
Type 2 - Double-Sided Printed Board
Type 3 - Multilayer Board without Blind or Buried Vias
Type 4 - Multilayer Board with Blind and/or Buried Vias
Type 5 - Multilayer Metal-Core Board without Blind or Buried Vias
Type 6 - Multilayer Metal-Core Board with Blind and/or Buried Vias
The contents of this standard may not apply to certain leading edge technologies. Refer to IPC-2221 for additional information.
Revision Level Changes
Changes that were incorporated in the current revision of this specification are indicated throughout by gray shading of the relevant subsection(s). Changes to a figure or table are indicated by gray shading of the Figure or Table header.